RT/duroid 6035HTC 2-Layer 60mil ENIG PCB for High Power RF Applications
1.Introduction
Rogers RT/duroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications. They are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.
2.Key Features
Stable Dielectric Constant: 3.5 ±0.05 at 10 GHz/23°C
Low Loss Characteristics: Dissipation factor of 0.0013 at 10 GHz/23°C
Thermal Stability: Thermal Coefficient of dielectric constant of -66 ppm/°C
Moisture Resistance: Moisture Absorption 0.06%
High Thermal Management: Thermal Conductivity of 1.44 W/m/K at 80°C
Dimensional Stability: CTE X-axis 19 ppm/°C, Y-axis 19 ppm/°C, Z-axis 39 ppm/°C
Safety Certified: UL 94-V0 Flammability
Modern Manufacturing: Lead-free Process Compatible
3.Benefits
Superior Heat Dissipation: High Thermal conductivity
Enhanced Power Handling: Improved dielectric heat dissipation enables lower operating temperatures for high power applications
Excellent RF Performance: Excellent high frequency performance
Signal Integrity: Lower insertion loss and excellent thermal stability of traces
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RT/duroid 6035HTC |
| Layer Count | Double sided |
| Board Dimensions | 77mm × 96mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 5/9 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 1.6mm |
| Finished Cu Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | Black |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper Layer 1 - 35 μm
RT/duroid 6035HTC - 1.524 mm (60mil)
Copper Layer 2 - 35 μm
6.PCB Statistics:
Components: 22
Total Pads: 65
Thru Hole Pads: 47
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 53
Nets: 2
7.Typical Applications
High power RF and microwave amplifiers
Power amplifiers, couplers, filters, combiners, power dividers
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
